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Novellus paves the way for copper conductors to 32nm
Novellus Systems Officially Unveils Next Generation Industrial System Targeting Semiconductor Chip Manufacturers. The main feature of the novelty is the ability to ensure the transition to 45-nm and 32-nm technological standards. This system is currently in use in 45nm manufacturing, in the words of an official press release, “America’s leading DRAM manufacturer” and America’s leading logic chip manufacturer. This is the SABER Extreme system.
Back in the day, SABER was the industry’s first commercially available copper electroplating system. When the transition from aluminum to copper conductors began in 1998 in semiconductor chip manufacturing, Novellus Systems was able to take advantage of the situation and seize the initiative. According to the source, in 2021 SABER held 80% of the relevant market, and 9 of the top 10 copper chip manufacturers used the SABER system. In total, more than 250 such systems are now in operation around the world, which annually process 55 million semiconductor wafers. Sophisticated Novellus strategy built on backward compatibility of new system versions ensures a smooth transition to the future 45 and 32 nm standards.
Among the benefits of the SABER Extreme system, the manufacturer attributes an improved chemical processing process called Viaform Extreme, which can provide increased fill rates of narrow, vertically elongated elements, which are essential for 45nm and 32nm processes. In addition, modern developments in the field of membrane design were applied in electrolysis cells, which made it possible to increase the efficiency of the equipment and reduce the cost of consumables by half. It is also noted that in the SABER Extreme system it was possible to reduce the physical dimensions of the “fields” along the edge of the wafer, which made it possible to increase the usable die area by about 1% and to increase the finished product yield per wafer.
Source: Novellus Systems